US Patent Issued to Micron Technology on Dec. 23 for "Embedded trace substrate assemblies, and related microelectronic device assemblies, electronic systems, and processes" (Singaporean Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,061, issued on Dec. 23, was assigned to Micron Technology Inc. (Boise, Idaho).

"Embedded trace substrate assemblies, and related microelectronic device assemblies, electronic systems, and processes" was invented by Bong Woo Choi (Singapore), Venkateswarlu Bhavanasi (Singapore) and Naga Raju Sykam (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embedded trace substrate assembly includes a build-up lamination material with an upper surface on a die side and a board side. A solder-resist material on the die side defines a bond-wire section where bond-finger pads include a first lateral width top first and second plating materials are on th...