US Patent Issued to Micron Technology on Dec. 16 for "Semiconductor package with hybrid wire bond and bump bond connections" (Idaho Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,196, issued on Dec. 16, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor package with hybrid wire bond and bump bond connections" was invented by Youngkwon Jo (Meridian, Idaho) and Won Joo Yun (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations described herein relate to various structures, integrated assemblies, and memory devices. In some implementations, a semiconductor package may include a substrate having a first plurality of substrate bond pads and a second plurality of substrate bond pads, and a semiconductor die having a first plurality of die bond pads and a second plurality of die bond pads. E...