US Patent Issued to Micron Technology on Dec. 16 for "Methods of forming conductive pipes between neighboring features, and integrated assemblies having conductive pipes between neighboring features" (Idaho Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,683, issued on Dec. 16, was assigned to Micron Technology Inc. (Boise, Idaho).

"Methods of forming conductive pipes between neighboring features, and integrated assemblies having conductive pipes between neighboring features" was invented by Ahmed Nayaz Noemaun (Boise, Idaho), Stephen W. Russell (Boise, Idaho), Tao D. Nguyen (Boise, Idaho) and Santanu Sarkar (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a pair of substantially parallel features spaced from one another by an intervening space. A conductive pipe is between the features and substantially parallel to the features. The...