US Patent Issued to Micron Technology on Aug. 5 for "Semiconductor assemblies including combination memory and methods of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,630, issued on Aug. 5, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor assemblies including combination memory and methods of manufacturing the same" was invented by Jing Cheng Lin (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices including vertically-stacked combination memory devices and associated systems and methods are disclosed herein. The vertically-stacked combination memory devices include at least one volatile memory die and at least one non-volatile memory die stacked on top of each other. The corresponding stack may be attached to a controller die that is configured to provide int...