US Patent Issued to Micron Technology on Aug. 5 for "Microelectronic devices including a selectively removable cap dielectric material, methods of forming the microelectronic devices, and related systems" (Idaho Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,633, issued on Aug. 5, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic devices including a selectively removable cap dielectric material, methods of forming the microelectronic devices, and related systems" was invented by Frank Speetjens (Boise, Idaho), Yucheng Wang (Boise, Idaho), Brendan Flynn (Boise, Idaho), S M Istiaque Hossain (Boise, Idaho), Tom J. John (Boise, Idaho) and Jeremy Adams (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device includes tiers of alternating dielectric and conductive materials, a cap oxide material vertically adjacent to the tiers, and pillars extending verticall...