US Patent Issued to Micron Technology on Aug. 5 for "Front end of line interconnect structures and associated systems and methods" (Idaho Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,131, issued on Aug. 5, was assigned to Micron Technology Inc. (Boise, Idaho).

"Front end of line interconnect structures and associated systems and methods" was invented by Kyle K. Kirby (Eagle, Idaho) and Kunal R. Parekh (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for a semiconductor device having a front-end-of-line structure are provided. The semiconductor device may include a dielectric material having a backside formed on a front side of a semiconductor substrate material and a front side, and an interconnect structure extending through the dielectric material. The interconnect structure may be electrically c...