ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,242, issued on Aug. 26, was assigned to Micron Technology Inc. (Boise, Idaho).
"Memory sub-system enclosure" was invented by Suresh Reddy Yarragunta (Bangalore, India), Deepu Narasimiah Subhash (Yeshwanthpu, India) and Ravi Kumar Kollipara (Puppalaguda, India).
According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. A PCB assembly may be secured between a heat spreader and a heat sink that are thermally coupled. The heat sink radiates heat absorbed from both sides of the PCB assembly. By connecting the heat spreader to the heat sink, heat is more effect...