ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,712, issued on Aug. 19, was assigned to Micron Technology Inc. (Boise, Idaho).
"Support structures for three dimensional memory arrays" was invented by Shuangqiang Luo (Boise, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for support structures for three dimensional memory arrays are described. For example, a portion of a memory die may formed at least in part from a stack of material layers deposited over a substrate, and the memory die may include a set of access lines in a staircase arrangement over the stack. At least a portion of the stack of material layers between the staircase arrangement and the substrat...