ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,097, issued on Aug. 19, was assigned to Micron Technology Inc. (Boise, Idaho).
"Substrates with continuous slot vias" was invented by Travis M. Jensen (Boise, Idaho), Walter L. Moden (Boise, Idaho) and Stephen F. Moxham (Boise, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "Substrates with continuous slot vias are disclosed herein. In one embodiment, a substrate comprises a first design layer, a second design layer, and an intermediary layer between the first and second design layers. The substrate further includes first and second signaling vias extending vertically through the intermediary layer between the first and second design layers. Th...