US Patent Issued to Micron Technology on Aug. 19 for "Apparatuses and methods for die replacement in stacked memory" (Texas Inventor)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,344, issued on Aug. 19, was assigned to Micron Technology Inc. (Boise, Idaho).

"Apparatuses and methods for die replacement in stacked memory" was invented by Scott Eugene Smith (Plano, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatuses and methods for repairing a memory are disclosed. In some examples, the memory may be a stacked memory that includes multiple die and at least one spare die. In some examples, a die may determine it is defective and provide signals causing the defective die to be disabled and a spare die to be enabled. In some examples, a component external to the memory, such as a memory controller, may determine a die...