US Patent Issued to Micron Technology on Aug. 12 for "Testing memory of wafer-on-wafer bonded memory and logic" (Idaho, Washington, California Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,780, issued on Aug. 12, was assigned to Micron Technology Inc. (Boise, Idaho).

"Testing memory of wafer-on-wafer bonded memory and logic" was invented by Kunal R. Parekh (Boise, Idaho), Glen E. Hush (Boise, Idaho), Sean S. Eilert (Penryn, Calif.) and Aliasger T. Zaidy (Seattle).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer-on-wafer bonded memory and logic device can enable high bandwidth transmission of data directly between a memory die and a logic die. Memory devices can be formed on a first wafer. First metal pads can be formed on the first wafer and coupled to the memory devices. The memory devices can be tested via the first metal pads....