US Patent Issued to Micron Technology on Aug. 12 for "Methods for forming conductive vias, and associated devices and systems" (Idaho Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,981, issued on Aug. 12, was assigned to Micron Technology Inc. (Boise, Idaho).

"Methods for forming conductive vias, and associated devices and systems" was invented by Trupti D. Gawai (Boise, Idaho), David S. Pratt (Meridian, Idaho), Ahmed M. Elsied (Boise, Idaho), David A Kewley (Boise, Idaho), Dale W. Collins (Boise, Idaho), Raju Ahmed (Boise, Idaho), Chelsea M. Jordan (Boise, Idaho) and Radhakrishna Kotti (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of manufacturing semiconductor devices, and associated systems and devices, are disclosed herein. In some embodiments, a method of manufacturing a semiconductor device incl...