US Patent Issued to Micron Technology on Aug. 12 for "Integrated assemblies and methods of forming integrated assemblies" (Idaho Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,599, issued on Aug. 12, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods of forming integrated assemblies" was invented by Sidhartha Gupta (Boise, Idaho), Naveen Kaushik (Boise, Idaho), Pankaj Sharma (Boise, Idaho) and Kyle A. Ritter (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a channel-material-pillar extending vertically through a stack of alternating conductive levels and insulative levels. The channel-material-pillar includes a first semiconductor material. A second semiconductor material is directly against an upper region of the cha...