US Patent Issued to Micron Technology on Aug. 12 for "Apparatuses and methods for coupling a plurality of semiconductor devices" (Idaho Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,050, issued on Aug. 12, was assigned to Micron Technology Inc. (Boise, Idaho).

"Apparatuses and methods for coupling a plurality of semiconductor devices" was invented by Matthew B. Leslie (Boise, Idaho), Timothy M. Hollis (Boise, Idaho) and Roy E. Greeff (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatuses and methods for coupling semiconductor devices are disclosed. In a group of semiconductor devices (e.g., a stack of semiconductor devices), a signal is provided to a point of coupling at an intermediate semiconductor device of the group, and the signal is propagated away from the point of coupling over different (e.g., opposit...