US Patent Issued to Micron Technology on April 22 for "Apparatus including thermal management mechanism and methods of manufacturing the same" (Indian Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,788, issued on April 22, was assigned to Micron Technology Inc. (Boise, Idaho).

"Apparatus including thermal management mechanism and methods of manufacturing the same" was invented by Suresh Reddy Yarragunta (Bangalore, India) and Deepu Narasimiah Subhash (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet fo...