US Patent Issued to Micron Technology on April 15 for "Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods" (Idaho, California Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,279,468, issued on April 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods" was invented by Vladimir Odnoblyudov (Eagle, Idaho) and Martin F. Schubert (Mountain View, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Solid-state transducers ("SSTs") and vertical high voltage SSTs having buried contacts are disclosed herein. An SST die in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the transducer structure, and a second semic...