US Patent Issued to Micron Technology on April 15 for "Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods" (Taiwanese, American Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,202, issued on April 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods" was invented by Bharat Bhushan (Taichung, Taiwan), Akshay N. Singh (Boise, Idaho), Bret K. Street (Meridian, Idaho), Debjit Datta (Taichung, Taiwan) and Eiichi Nakano (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Stacked semiconductor assemblies, and related systems and methods, are disclosed herein. A representative stacked semiconductor assembly can include a lowermost die and two or more modules carried by an upper surface of the lowermost die. Each of th...