US Patent Issued to Micron Technology on April 1 for "Microelectronic devices comprising stack structures having pillars and elliptical conductive contacts" (Idaho Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,267,997, issued on April 1, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic devices comprising stack structures having pillars and elliptical conductive contacts" was invented by Lifang Xu (Boise, Idaho), Sidhartha Gupta (Boise, Idaho), Kar Wui Thong (Boise, Idaho) and Harsh Narendrakumar Jain (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a microelectronic device including a first stack structure comprising alternating levels of insulative structures and other insulative structures, forming strings of memory cells through the first stack structure, forming a second stack structure over the first...