ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,377, issued on Oct. 21, was assigned to MicroCircuit Laboratories LLC (Kennett Square, Pa.).
"Robotic cover sealer" was invented by Richard D. Richardson (Kennett Square, Pa.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A scaling system is described using parameters. The system may obtain input data comprising one or more of a set of package parameters, a set of cover parameters, a set of seal ring parameters, or a set of power parameters. The system may, based at least on the set of cover parameters and the set of package parameters, accurately place the cover on top of the package. The system may use the vision data for programming of the seal o...