US Patent Issued to Microchip Technology on Sept. 9 for "Integrated circuit structure including a metal-insulator-metal (MIM) capacitor module and a thin-film resistor (TFR) module" (Washington Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,359, issued on Sept. 9, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Integrated circuit structure including a metal-insulator-metal (MIM) capacitor module and a thin-film resistor (TFR) module" was invented by Yaojian Leng (Vancouver, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure including a metal-insulator-metal (MIM) capacitor module and a thin-film resistor (TFR) module is provided. The MIM capacitor module includes a bottom electrode base formed in a lower metal layer, a bottom electrode formed in a dielectric region between the lower metal layer and an upper metal layer, an insulator form...