US Patent Issued to Microchip Technology on Sept. 23 for "Multi-capacitor module including a nested metal-insulator-metal (MIM) structure" (Washington Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,281, issued on Sept. 23, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Multi-capacitor module including a nested metal-insulator-metal (MIM) structure" was invented by Yaojian Leng (Vancouver, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-capacitor module includes a nested metal-insulator-metal (MIM) structure including a cup-shaped first electrode, a cup-shaped first insulator formed over the cup-shaped first electrode, a cup-shaped second electrode formed over the cup-shaped first insulator, a cup-shaped second insulator formed over the cup-shaped second electrode, and a third electrode formed over the cup-shaped se...