US Patent Issued to Microchip Technology on Sept. 23 for "Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles" (Oregon, California Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,502, issued on Sept. 23, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles" was invented by Bomy Chen (Newark, Calif.) and Justin Sato (West Linn, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes an integrated circuit package including a die mounted on a die carrier, a mold structure at least partially encapsulating the mounted die, and a heat transfer chimney formed on the die. The heat transfer chimney extends at least partially through the mold structure to transfer heat away from the die. The heat trans...