US Patent Issued to Microchip Technology on Oct. 7 for "Multi-capacitor module including a stacked metal-insulator-metal (MIM) structure" (Washington Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,614, issued on Oct. 7, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Multi-capacitor module including a stacked metal-insulator-metal (MIM) structure" was invented by Yaojian Leng (Vancouver, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-capacitor module includes a stacked metal-insulator-metal (MIM) structure including a cup-shaped first electrode, a cup-shaped first insulator formed over the cup-shaped first electrode, a cup-shaped second electrode formed over the cup-shaped first insulator, a cup-shaped second insulator formed over the cup-shaped second electrode, a third electrode formed over the cup-shaped second i...