US Patent Issued to Microchip Technology on Oct. 21 for "Integrated inductor with a stacked metal wire" (Oregon Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,424, issued on Oct. 21, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Integrated inductor with a stacked metal wire" was invented by Yaojian Leng (Portland, Ore.) and Justin Sato (West Linn, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A low-resistance thick-wire integrated inductor may be formed in an integrated circuit (IC) device. The integrated inductor may include an elongated inductor wire defined by a metal layer stack including an upper metal layer, middle metal layer, and lower metal layer. The lower metal layer may be formed in a top copper interconnect layer, the upper metal layer may be formed in an aluminum bond p...