US Patent Issued to Microchip Technology on Oct. 14 for "Integrated inductor including multi-component via layer inductor element" (Washington Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,677, issued on Oct. 14, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Integrated inductor including multi-component via layer inductor element" was invented by Yaojian Leng (Vancouver, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes an integrated inductor and metal interconnect formed in an integrated circuit (IC) structure. The integrated inductor includes an inductor wire having a portion defined by an inductor element stack including (a) a metal layer inductor element formed in a metal layer in the IC structure and (b) a multi-component via layer inductor element formed in a via layer in the IC structure ver...