ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,976, issued on Nov. 4, was assigned to Microchip Technology Inc. (Chandler, Ariz.).
"Integrated thermocouple" was invented by Yaojian Leng (Vancouver, Wash.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system includes a metal tub structure formed in an integrated circuit (IC) structure, a first metal component, and a second metal component. The first metal component is formed from a first metal. The first metal component is formed in an opening defined by the metal tub structure, and includes a first metal first junction element, a first metal second junction element, and a first metal bridge electrically connected to the first metal first juncti...