ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,713, issued on Jan. 20, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Integrated circuit package including an integrated shunt resistor" was invented by Gerald Steele (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package includes a partial leadframe including (a) a shunt resistor leadframe element including a pair of shunt resistor contacts and a shunt resistor conductively connected between the pair of shunt resistor contacts and (b) at least one external contact leadframe element separate from the shunt resistor leadframe element, the at least one external contact leadframe element allow...