US Patent Issued to Microchip Technology on Feb. 10 for "Method of forming an integrated circuit via" (Oregon, Arizona Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,650, issued on Feb. 10, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Method of forming an integrated circuit via" was invented by Daniel Baker (Phoenix), Justin Sato (West Linn, Ore.) and Chris Sundahl (Gresham, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a via is provided. A lower metal element is formed, and a first patterned photoresist is used to form a sacrificial element over the lower metal element. A dielectric region including a dielectric element projection extending upwardly above the sacrificial element is formed. A second patterned photoresist including a second photoresist opening is formed,...