US Patent Issued to Microchip Technology on April 8 for "Integrated inductor with inductor wire formed in an integrated circuit layer stack" (Washington Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,639, issued on April 8, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Integrated inductor with inductor wire formed in an integrated circuit layer stack" was invented by Yaojian Leng (Vancouver, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes (a) an integrated inductor having an inductor wire and (b) a metal interconnect arrangement, both formed in an integrated circuit layer stack of alternating metal layers and via layers. At least a portion of the inductor wire is defined by an inductor element stack including multiple metal layer inductor elements formed in multiple respective metal layers, and multiple via...