US Patent Issued to MICRO-STAR INT'L, MSI ELECTRONIC (KUN SHAN) on Feb. 3 for "Heat dissipation assembly and electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,289, issued on Feb. 3, was assigned to MICRO-STAR INT'L Co. LTD. (New Taipei, Taiwan) and MSI ELECTRONIC (KUN SHAN) Co. LTD. (Kunshan, China).

"Heat dissipation assembly and electronic device" was invented by Chia-Ming Chang (Taipei, Taiwan) and Ching-Chi Wu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure provides a heat dissipation assembly and an electronic device. The heat dissipation assembly includes a first fan, a first fin assembly, a second fan, a second fin assembly, a vapor chamber and a heat dissipation sheet. The second fan has a second inlet, at least one second outlet and a side outlet. The at least one se...