US Patent Issued to Micraft System Plus on June 3 for "Apparatus for transferring electronic component from flexible carrier substrate to flexible target substrate and method of transferring electronic component" (Taiwanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,630, issued on June 3, was assigned to Micraft System Plus Co. Ltd. (Taoyuan, Taiwan).

"Apparatus for transferring electronic component from flexible carrier substrate to flexible target substrate and method of transferring electronic component" was invented by Chingju Lin (Taoyuan, Taiwan) and Yi Xian Wu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for transferring an electronic component from a flexible carrier substrate to a flexible target substrate is provided. The apparatus includes a first frame, a second frame, an abutment element and a deformation generating mechanism. The first frame is used to carry the flex...