US Patent Issued to Meta Platforms Technologies on Sept. 16 for "Stacked 3D memory architecture for power optimization" (California, Washington, Texas, Arizona Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,817, issued on Sept. 16, was assigned to Meta Platforms Technologies LLC (Menlo Park, Calif.).

"Stacked 3D memory architecture for power optimization" was invented by Ahmad Abdel Rauof Samih (Austin, Texas), Daniel Henry Morris (Mountain View, Calif.), Hadi Asgharimoghaddam (Kirkland, Wash.), Pietro Caragiulo (Palo Alto, Calif.), Vamshi Krishna Lakkaraju (Chandler, Ariz.) and Vivek Venkatesan (Pleasanton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A headset includes a camera a 3D stacked memory configured to store image data captured by the camera, and a System-on-Chip (SoC) configured to process the image data stored in the 3D stacked m...