ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,050, issued on Oct. 21, was assigned to META PLATFORMS TECHNOLOGIES LLC (Menlo Park, Calif.).
"Heat pipe including an integrated antenna" was invented by Michael Nikkhoo (Saratoga, Calif.), Vivek Sahu (San Diego) and Brian Toleno (Cupertino, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polyimide-based heat pipe is described. In examples, the heat pipe may include a first substrate including raised features on a surface of the substrate. In examples, the first substrate is covered with a second substrate or cover. At least the second substrate comprises polyimide. An outer surface of the heat pipe, e.g., the second substrate, includes one ...