US Patent Issued to Meta Platforms Technologies on May 27 for "Stack-PCB architecture with embedded vapor chamber" (California, Washington Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,408, issued on May 27, was assigned to Meta Platforms Technologies LLC (Menlo Park, Calif.).

"Stack-PCB architecture with embedded vapor chamber" was invented by Michael Nikkhoo (Saratoga, Calif.), Brian Toleno (Cupertino, Calif.) and Patrick Codd (Carnation, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a ...