US Patent Issued to Meta Platforms Technologies on May 13 for "Methods for correcting substrate thickness variation for waveguide applications" (Washington, California, Hawaii Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,298,551, issued on May 13, was assigned to Meta Platforms Technologies LLC (Menlo Park, Calif.).

"Methods for correcting substrate thickness variation for waveguide applications" was invented by Richard Farrell (Seattle), Siddharth Buddhiraju (Palo Alto, Calif.), Jilin Yang (Redmond, Wash.), Pasqual Rivera (Woodinville, Wash.), Anneli Munkholm (Wailea, Hawaii) and Keith Rozenburg (Bellevue, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are techniques for waveguide displays. According to some embodiments, a method for fabricating a multi-layer optical device comprising includes measuring thickness variations within a target area o...