US Patent Issued to Meta Platforms Technologies on June 10 for "Thermal conduit for electronic device" (California Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,845, issued on June 10, was assigned to Meta Platforms Technologies LLC (Menlo Park, Calif.).

"Thermal conduit for electronic device" was invented by Michael Nikkhoo (Saratoga, Calif.) and Brian Toleno (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible thermal conduit includes a first material extending along an axial length of the thermal conduit, the first material having a first thermal conductivity, a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity, and a thermally conductive silicone molded over ...