US Patent Issued to Meta Platforms Technologies on Jan. 13 for "Methods for forming electronic device housings" (California, Washington, Texas Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,944, issued on Jan. 13, was assigned to Meta Platforms Technologies LLC (Menlo Park, Calif.).

"Methods for forming electronic device housings" was invented by Zhicong Yao (Bellevue, Wash.), Luke Murphy (Heath, Texas), Robert Liang (Dublin, Calif.) and Eric Santini (Redwood City, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Housings for electronic devices may include a steel body, such as a stainless steel body, that has an outer portion and an inner portion. The outer portion may exhibit an average Vickers hardness of 200 HV or higher. The inner portion may exhibit an average Vickers hardness of 180 HV or lower. The lower hardness of the in...