ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,305, issued on Aug. 19, was assigned to Meta Platforms Technologies LLC (Menlo Park, Calif.).
"Semiconductor reconstitution" was invented by Rajendra D. Pendse (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An article including a semiconductor die including integrated circuitry is described. The semiconductor die defines a first major surface, a second major surface opposite the first major surface, and a plurality of perimeter walls joining the first major surface and the second major surface. The article further includes at least one through silicon via extending through the semiconductor die between the first major surface and th...