ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,114, issued on Oct. 7, was assigned to Meta Platforms Inc. (Menlo Park, Calif.).
"Flex bonded integrated circuits" was invented by Sandeep Rekhi (San Jose, Calif.) and Pradip Sairam Pichumani (Bellevue, Wash.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments relate to an integrated circuit package having an integrated circuit die connected to a package substrate through conductors of a flex cable. The flex cable includes an insulating housing made of an insulating material and a plurality of conductors disposed inside the insulating housing. Each conductor of the plurality of conductors is connected to a first contact of a plurality of conta...