US Patent Issued to Meta Platforms on Jan. 13 for "Integrated circuit interconnects with integrated in-line capacitors" (Washington Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,925, issued on Jan. 13, was assigned to Meta Platforms Inc. (Menlo Park, Calif.).

"Integrated circuit interconnects with integrated in-line capacitors" was invented by Pradip Sairam Pichumani (Bellevue, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system that includes improved integrated circuit interconnects integrated with interconnect capacitors that reduce noise and improve signal quality is disclosed. The system comprises a first circuit board layer including a contact region of a conductor trace. The system further comprises a second layer including an interconnect capacitor, wherein the interconnect capacitor comprises a first side ...