US Patent Issued to Merry Electronics(Shenzhen) on Sept. 30 for "Micro-electromechanical packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,293, issued on Sept. 30, was assigned to Merry Electronics(Shenzhen) Co. Ltd. (ShenZhen, China).

"Micro-electromechanical packaging structure" was invented by Yung-Hsiang Chang (Taichung, Taiwan), Jia Yin Wu (Taichung, Taiwan) and Yueh-Kang Lee (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micro-electromechanical packaging structure including a substrate, a sensing module, a waterproof layer, and a cover is provided. The substrate has a first surface, a second surface, and an acoustic hole penetrating through the first surface and the second surface. The acoustic hole has an upper opening and a lower opening, and an aperture of...