US Patent Issued to Merck Patent on Oct. 14 for "Polymer, semiconductor composition comprising polymer, and method for manufacturing film using semiconductor composition" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,822, issued on Oct. 14, was assigned to Merck Patent GmbH (Darmstadt, Germany).

"Polymer, semiconductor composition comprising polymer, and method for manufacturing film using semiconductor composition" was invented by Hiroshi Hitokawa (Kakegawa, Japan), Tomohide Katayama (Kakegawa, Japan), Tomotsugu Yano (Kakegawa, Japan), Rui Zhang (Kakegawa, Japan), Aritaka Hishida (Kakegawa, Japan), Masato Suzuki (Kakegawa, Japan), Rikio Kozaki (Kakegawa, Japan) and Toshiya Okamura (Kakegawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a novel polymer capable of reducing sublimate during film formation and a composition comprising the same. T...