US Patent Issued to MEMSensing Microsystems (Suzhou China) on June 3 for "Bulk acoustic wave resonator and fabrication method for the bulk acoustic wave resonator" (Chinese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,323,120, issued on June 3, was assigned to MEMSensing Microsystems (Suzhou China) Co. Ltd. (Suzhou, China).

"Bulk acoustic wave resonator and fabrication method for the bulk acoustic wave resonator" was invented by Ping Lv (Suzhou, China), Gang Li (Suzhou, China) and Wei Hu (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a bulk acoustic wave resonator and a fabrication method for the bulk acoustic wave resonator. The fabrication method includes: preparing a cavity with a top opening on a first silicon wafer; preparing an insulating layer on an upper surface of a second silicon wafer, and preparing a resonant piezoelectric stac...