ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,533, issued on Nov. 18, was assigned to Mellanox Technologies Ltd. (Yokneam, Israel).
"Electronic modules for co-packaged optics and copper packages" was invented by Amit Oren (Ramat Hasharon, Israel), Barak Freedman (Binyamina, Israel) and Casper Dietrich (Roskilde, Denmark).
According to the abstract* released by the U.S. Patent & Trademark Office: "Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system pri...