US Patent Issued to Mellanox Technologies on March 18 for "Mirror image of geometrical patterns in stacked integrated circuit dies" (Israeli Inventor)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,178, issued on March 18, was assigned to Mellanox Technologies Ltd (Yokneam, Israel).

"Mirror image of geometrical patterns in stacked integrated circuit dies" was invented by Ido Bourstein (Pardes Hana- Karkur, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a first integrated circuit (IC) die and a second IC die. The first IC die includes a first set of contact pads arranged in a first geometrical pattern on a first surface of the first IC die, the second IC die includes a second set of the contact pads that are arranged, on a second surface of the second IC die, in a second geometrical pattern that is a mirror...