ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,541, issued on Aug. 26, was assigned to MELEXIS TECHNOLOGIES SA (Bevaix, Switzerland).
"Stacked die assembly" was invented by Arnaud Laville (Neuchatel, Switzerland), Eric Lahaye (Nandrin, Belgium) and Jian Chen (Heist-op-den-Berg, Belgium).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical...