ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,459, issued on June 24, was assigned to MEKTEC Corp. (Tokyo).
"Flexible printed wiring board and electric wiring" was invented by Shunsuke Aoyama (Tokyo) and Masanori Hirata (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a flexible printed wiring board including: a base film which is an insulating layer; a first conductor layer; a second conductor layer; and a through-hole, in which the first conductor layer is provided on one surface of the base film, the second conductor layer is provided on the other surface of the base film, and the through-hole is provided so as to penetrate the base film and electrically connect the first co...