ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,573, issued on April 29, was assigned to Mektec Corp. (Tokyo) and Osaka University (Osaka, Japan).
"Adhesive sheet" was invented by Masayuki Iwase (Osaka, Japan), Teppei Araki (Osaka, Japan), Tsuyoshi Sekitani (Osaka, Japan) and Shusuke Yoshimoto (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "To provide an adhesive sheet, the sheet increasing manufacturing efficiency of products including an adhesive agent layer, while using the adhesive agent layer to which an electro-conductive organic polymer compound is added. An adhesive sheet for use in applying a wiring board to a surface onto which the wiring board is to be applied, the adhesive...