ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,712, issued on Nov. 25, was assigned to Medtronic Inc. (Minneapolis).
"Integrated circuit package and method of forming same" was invented by Chunho Kim (Phoenix) and Mark E. Henschel (Phoenix).
According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a glass core layer, where the glass core layer includes a first major surface, a second major surface, and a cavity disposed between the first major surface and the second major surface of the glass core layer. The package also includes a die disposed in the cavity of the...