US Patent Issued to Medtronic on May 6 for "Feedthrough header assembly and device including same" (Arizona, Minnesota Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,290,693, issued on May 6, was assigned to Medtronic Inc. (Minneapolis).

"Feedthrough header assembly and device including same" was invented by Mark E. Henschel (Phoenix), Andrew J. Ries (Lino Lakes, Minn.), Songhua Shi (Tempe, Ariz.), Jemmy Sutanto (Scottsdale, Ariz.) and Lea Ann Nygren (Bloomington, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of an electronics module and an implantable medical device that includes such module are disclosed. The module includes a feedthrough header assembly having a conductive header that includes a conductive inner surface, an outer surface, and a contact disposed on the inner surface and ...